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Taconic RF-35 High Frequency Printed Circuit Board: DK 3.5 RF PCB Options (10mil, 20mil, 30mil, 60mil)

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Product Overview

Introducing the Taconic RF-35 High Frequency Printed Circuit Board, a premier choice for low-cost, high-volume commercial microwave and radio frequency applications. This PCB is constructed from an organic-ceramic laminate material from Taconic's ORCER family, characterized by:

Material Composition: Based on woven glass reinforcement and Taconic's advanced ceramic filling technology.
Peel Strength: Exceptional peel strength for ½ oz and 1 oz copper, essential for rework situations.
Thermal Properties: Glass transition temperature (Tg) exceeding 315°C.
Moisture Resistance: Ultra-low moisture absorption and low dissipation factor minimize phase shifts at high frequencies.
Dimension Stability: Woven fabric design ensures stable dimensions.






Copper Options

Our RF-35 PCBs come with electrodeposited copper options available in:

10mil,20mil,30mil,60mil


Benefits

By choosing RF-35, you gain advantages such as:

Cost-Effectiveness: Ideal for high-volume production.
Enhanced Performance: Excellent peel strength and low dissipation factors.
Surface Smoothness: Improved surface quality for better reliability.


Typical Applications

RF-35 PCBs are perfect for:
Power Amplifiers
Filters and Couplers
Passive Components


Our PCB Capability (RF-35)

PCB Capability (RF-35) 
PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35
Dielectric constant: 3.5
Dissipation Factor 0.0018
Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, ENEIPIG, Pure gold, OSP etc..

RF-35 Typical Value

Click to expand/collapse the table
RF-35 Typical Values
Property Test Method Unit Value Unit Value
Dielectric Constant @ 1.9 GHz IPC-TM 650 2.5.5 3.5 3.5
Dissipation Factor @ 1.9 GHz IPC-TM 650 2.5.5 0.0018 0.0018
Moisture Absorption (.060") IPC-TM 650 2.6.2.1 % 0.02 % 0.02
Peel Strength (1/2 oz. copper) IPC-TM 650 2.4.8 lbs./linear inch >8.0 N/mm >1.5
Peel Strength (1 oz. copper) IPC-TM 650 2.4.8 lbs./linear inch >10.0 N/mm >1.8
Dielectric Breakdown IPC-TM 650 2.5.6 kV 41 kV 41
Volume Resistivity IPC-TM 650 2.5.17.1 Mohm/cm 1.26 x 109 Mohm/cm 1.26 x 109
Surface Resistivity IPC-TM 650 2.5.17.1 Mohm 1.46 x 108 Mohm 1.46 x 108
Arc Resistance IPC TM 650 2.5.1 seconds >180 seconds >180
Flexural Strength Lengthwise ASTM D 790 psi >22,000 N/mm2 >152
Flexural Strength Crosswise ASTM D 790 psi >18,000 N/mm2 >124
Thermal Conductivity ASTM F 433 W/m/K 0.24 W/m/K 0.24
Tensile Strength Lengthwise ASTM D 638 psi 27,000 N/mm2 187
Tensile Strength Crosswise ASTM D 638 psi 21,000 N/mm2 145
Dimensional Stability Lengthwise IPC-TM 650 2.4.39 in/in 0.00004 mm/mm 0.00004
Dimensional Stability Crosswise IPC-TM 650 2.4.39 in/in -0.0001 mm/mm -0.0001
x-y CTE ASTM D 3386 (TMA) ppm/°C 19-24 ppm/°C 19-24
z CTE ASTM D 3386 (TMA) ppm/°C 64 ppm/°C 64
Flammability UL-94 V-0 V-0
Hardness Rockwell M Scale 34 34

DK list

Type Dk
TLY-5A 2.17 
TLY-5 2.20 
TLY-3 2.33 
TLT-0 TLX-0 2.45 
TLT-9 TLX-9 2.50 
TLT-8 TLX-8 2.55 
TLT-7 TLX-7 2.60 
TLT-6 TLX-6 2.65 
TLE-95 2.95 
TLC-27 2.75 
TLC-30 3.00 
TLC-32 3.20 
RF-30 3.00 
RF-35 RF-35P 3.50 
RF-60 6.15 
CER-10 10

Explore the capabilities of our RF-35 high frequency printed circuit boards today and elevate your design solutions!


Next RF-35 High Frequency Printed Circuit Board: 30mil Double-Sided PCB with Immersion Gold and Black Solder Mask